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Exhibition Recap | Sanwood at the Data Storage & Computing Ecosystem Conference

​The Data Storage & Computing Ecosystem Conference has successfully concluded. Sanwood showcased its advanced environmental test solutions at Booth , engaging with industry peers to explore reliability and sustainability for AI computing infrastructure.

Exhibition Recap | Sanwood at the Data Storage & Computing Ecosystem Conference

The Data Storage & Computing Ecosystem Conference has successfully concluded. Sanwood showcased its advanced environmental test solutions at Booth , engaging with industry peers to explore reliability and sustainability for AI computing infrastructure.


Keynote Speech

On the first day, our Chairman, Mr. Shua Jiaxiong, delivered a keynote titled:“Environmental Testing Logic in the Era of High Computing Power – Supporting Next-Generation Data Infrastructure.”The presentation addressed critical reliability challenges in data centers and storage systems, highlighting the essential role of environmental testing throughout the lifecycle of computing hardware.


Awards & Recognition

Sanwood's self-developed chip-level ESSD test chamber received an Innovation Award.Additionally, the company was honored as a council member of the Data Storage & Computing Committee under the China Computer Industry Association.


Booth Highlights

Sanwood's booth attracted strong attention from customers, partners, and industry experts. Our team engaged deeply with visitors, presenting tailored environmental simulation and reliability testing solutions for next-generation data infrastructure.


Featured Equipment

Bench-top Temperature & Humidity Test Chamber

Temperature: -40°C to +150°C

Stability: ≤ ±0.5°C (no load)

Heating: avg. 3°C/min | Cooling: avg. 1°C/min


Highly Accelerated Stress Test System

Temperature: +105°C to +135°C (optional +145°C)

Humidity: 70%RH to 100%RH

Pressure: 0.02–0.212 MPa (optional 0.314 MPa)


Rapid-Rate Temperature Change Chambers

Temperature: -70°C to +180°C

Ramp rate: 5–25°C/min

Stability: ≤ ±0.5°C


Chip-Level ESSD Test Chamber

Temperature: -50°C to +150°C

Automated door design for efficient integration

Accurately simulates environmental stress to screen early ESSD failures

Our team also introduced customized solutions including Highly Accelerated Stress Test Systems, precision ovens, Bench-top Temperature & Humidity Test Chambers, and Rapid Temperature Change Test Chambers, demonstrating Sanwood's technical expertise and innovation in environmental testing.


Collaborative Development

This conference served as a key platform for industry collaboration and innovation. Sanwood actively engaged in discussions on ecosystem integration, talent development, and industry-academia collaboration, contributing to a reliable foundation for digital transformation.

Thank you to everyone who visited our booth!Sanwood will continue to advance environmental testing technologies, delivering high-performance solutions for next-generation data infrastructure in the era of high computing power.



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